DocumentCode
1958450
Title
Techniques for including dielectrics when extracting passive low-order models of high speed interconnect
Author
Daniel, L. ; Sangiovanni-Vincentelli, A. ; White, J.
Author_Institution
California Univ., Berkeley, CA, USA
fYear
2001
fDate
4-8 Nov. 2001
Firstpage
240
Lastpage
244
Abstract
Interconnect structures including dielectrics can be modeled by an integral equation method using volume currents and surface charges for the conductors, and volume polarization currents and surface charges for the dielectrics. In this paper we describe a mesh analysis approach for computing the discretized currents in both the conductors and the dielectrics. We then show that this fully mesh-based formulation can be cast into a form using provably positive semidefinite matrices, making for easy application of Krylov-subspace based model-reduction schemes to generate accurate guaranteed passive reduced-order models. Several printed circuit board examples are given to demonstrate the effectiveness of the strategy.
Keywords
dielectric thin films; high-speed integrated circuits; integral equations; integrated circuit interconnections; integrated circuit layout; interconnections; matrix algebra; multichip modules; printed circuit layout; reduced order systems; Krylov-subspace based model-reduction schemes; MCMs; PCBs; conductors; dielectrics; discretized currents; high speed interconnect; integral equation method; integrated circuits; mesh analysis approach; multi-chip modules; passive low-order models; passive reduced-order models; positive semidefinite matrices; printed circuit board; surface charges; volume currents; volume integral equation; volume polarization currents; Conductors; Dielectrics; Electronic circuits; Integral equations; Integrated circuit interconnections; Jacobian matrices; Maxwell equations; Permission; Printed circuits; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-7247-6
Type
conf
DOI
10.1109/ICCAD.2001.968625
Filename
968625
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