DocumentCode
1958861
Title
Memory characteristics of double-layer metal and semiconductor heterogeneous nanocrystals embedded in SiO2
Author
Ni, Henan ; Wu, Liangcai ; Song, Zhitang ; Hui, Chun
Author_Institution
Res. Inst. of Micro/Nano Sci. & Technol., Shanghai Jiaotong Univ., Shanghai
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
672
Lastpage
675
Abstract
MOS capacitor structure with double-layer heterogeneous nanocrystals consisting of metal and semiconductor embedded in gate oxide for the applications of nonvolatile memory have been fabricated and characterized. By combining the self-assembled Ni nanocrystals and vacuum electron-beam co-evaporated Si nanocrystals in SiO2 matrix, the MOS capacitor with double-layer heterogeneous nanocrystals can appear large charge storage capacity and improved retention characteristics compared to that with single-layer nanocrystals. The metal nanocrystals at the lower stack enable the direct tunneling mechanism to obtain larger flat voltage shift, while the Si nanocrystals at the upper stack works as an additional charge trap layer to enhance the retention time and the flat voltage shift.
Keywords
MOS capacitors; electron traps; elemental semiconductors; hole traps; nanostructured materials; nickel; random-access storage; self-assembly; semiconductor storage; silicon; silicon compounds; tunnelling; MOS capacitor structure; Ni-Si-SiO2; charge storage capacity; charge trap layer; direct tunneling mechanism; double-layer metal-semiconductor heterogeneous nanocrystals; flat voltage shift; gate oxide; nonvolatile memory; retention time; self-assembled nickel nanocrystals; vacuum electron-beam coevaporated silicon nanocrystals; MOS capacitors; Monitoring; Nanocrystals; Potential well; Rapid thermal annealing; Scanning electron microscopy; Size control; Transmission electron microscopy; Tunneling; Voltage; MOS capacitor; Nanocrystal memory; Nonvolatile memory;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068669
Filename
5068669
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