Title :
A uncooled α-Si infrared detector with novel thermal isolation method
Author :
Fang, Huajun ; Liu, Xingming ; Liu, Litian
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing
Abstract :
A uncooled amorphous silicon (alpha-Si) infrared (IR) detector with novel thermal isolation method has been fabricated and characterized. The unique sandwich IR absorption structure based on polyimide (PI) and bottom metal reflective layer is presented. The fabrication process of the IR detectors is described. The absorption characteristics of the IR detectors have been investigated. The responsivity and detectivity of the IR detector are also discussed. The measurement results show that the polyimide layer exhibits good thermal isolating characteristics and the unique sandwich IR absorption structure is beneficial to the enhancement of detectivity. The TCR of alpha-Si film resistance is up to -2.8%. The detectivity of 1.7times108 cmmiddotHz1/2W-1 is achieved with chopping frequency of 30 Hz at a bias voltage of 5 V. Compared with other IR detectors, the structures, using PI as thermal isolation layer, simplifies the fabrication process, reduces the cost and increases the yield. It is suitable for large-scale focal plane arrays (FPA).
Keywords :
amorphous semiconductors; elemental semiconductors; focal planes; infrared detectors; isolation technology; polymer films; sandwich structures; silicon; FPA; IR detector fabrication process; Si; bottom metal reflective layer; focal plane arrays; frequency 30 Hz; polyimide layer; sandwich IR absorption structure; thermal isolation method; uncooled amorphous silicon infrared detector; voltage 5 V; Amorphous silicon; Costs; Electrical resistance measurement; Electromagnetic wave absorption; Fabrication; Frequency; Infrared detectors; Large-scale systems; Polyimides; Voltage; α-Si; polyimide; uncooled infrared detector;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
DOI :
10.1109/NEMS.2009.5068671