• DocumentCode
    1959161
  • Title

    Microfabrication of conductive PDMS on flexible substrates for biomedical applications

  • Author

    Cong, Hailin ; Pan, Tingrui

  • Author_Institution
    Dept. of Biomed. Eng., Univ. of California, Davis, CA
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    731
  • Lastpage
    734
  • Abstract
    In this paper, we present microfabrication of a novel photopatternable conductive PDMS material with silver powder as conductive filler and benzophenone as photosensitive component, employing standard photolithography approach. An array of miniaturized capacitive pressure sensors is micromachined onto flexible polymeric transparency using this approach. Highest conductivity of ~104 Sldrm-1 and minimal feature resolution of 60 mum have been successfully achieved. In addition, a thermal compression step can mold the microfabricated device into a desired shape (e.g., contact lens). The unique combination of physical properties from both silver filler and PDMS matrix along with photopatternability makes the conductive PDMS composite an excellent material for biological and clinical sensing applications.
  • Keywords
    bioMEMS; biomechanics; biosensors; capacitive sensors; conducting materials; flexible structures; microsensors; photochemistry; photoresists; pressure sensors; benzophenone; biological sensing application; biomedical application; clinical sensing application; conductive PDMS material; conductive filler; flexible polymeric transparency; flexible substrates; microfabrication; micromachining; miniaturized capacitive pressure sensor; photolithography; photopatternability; photosensitive component; silver powder; thermal compression; Biological materials; Biomedical materials; Biosensors; Capacitive sensors; Conducting materials; Lithography; Polymers; Powders; Sensor arrays; Silver; Conductive Photoresist; Microfabrication; Photolithography; Polydimethylsiloxane (PDMS); Silver Powder;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068682
  • Filename
    5068682