DocumentCode
1959161
Title
Microfabrication of conductive PDMS on flexible substrates for biomedical applications
Author
Cong, Hailin ; Pan, Tingrui
Author_Institution
Dept. of Biomed. Eng., Univ. of California, Davis, CA
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
731
Lastpage
734
Abstract
In this paper, we present microfabrication of a novel photopatternable conductive PDMS material with silver powder as conductive filler and benzophenone as photosensitive component, employing standard photolithography approach. An array of miniaturized capacitive pressure sensors is micromachined onto flexible polymeric transparency using this approach. Highest conductivity of ~104 Sldrm-1 and minimal feature resolution of 60 mum have been successfully achieved. In addition, a thermal compression step can mold the microfabricated device into a desired shape (e.g., contact lens). The unique combination of physical properties from both silver filler and PDMS matrix along with photopatternability makes the conductive PDMS composite an excellent material for biological and clinical sensing applications.
Keywords
bioMEMS; biomechanics; biosensors; capacitive sensors; conducting materials; flexible structures; microsensors; photochemistry; photoresists; pressure sensors; benzophenone; biological sensing application; biomedical application; clinical sensing application; conductive PDMS material; conductive filler; flexible polymeric transparency; flexible substrates; microfabrication; micromachining; miniaturized capacitive pressure sensor; photolithography; photopatternability; photosensitive component; silver powder; thermal compression; Biological materials; Biomedical materials; Biosensors; Capacitive sensors; Conducting materials; Lithography; Polymers; Powders; Sensor arrays; Silver; Conductive Photoresist; Microfabrication; Photolithography; Polydimethylsiloxane (PDMS); Silver Powder;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068682
Filename
5068682
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