Title :
Low profile silicon photonics packaging approach featuring configurable multiple electrical and optical connectivity
Author :
Galan, J.V. ; Tekin, T. ; Preve, G.B. ; Brimont, A. ; Llopis, M. ; Sanchis, P.
Author_Institution :
Nanophotonics Technol. Center, Univ. Politec. de Valencia, Valencia, Spain
Abstract :
A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.
Keywords :
electronics packaging; integrated optics; optical couplers; silicon; configurable multiple electrical and optical connectivity; low profile silicon photonics packaging; multiple input/output grating; optical interfaces; package solution; silicon photonic integrated circuits; standard compatible lateral orientation; subassembly submount carrier; Arrays; Couplers; Gratings; Optical fiber couplers; Optical fiber devices; Integrated optics; grating couplers; packaging; silicon on insulator technology;
Conference_Titel :
Group IV Photonics (GFP), 2011 8th IEEE International Conference on
Conference_Location :
London
Print_ISBN :
978-1-4244-8338-9
DOI :
10.1109/GROUP4.2011.6053822
