Title :
Photonic wire bonding for single-mode chip-to-chip interconnects
Author :
Lindenmann, Nicole ; Balthasar, G. ; Palmer, R. ; Schuele, S. ; Leuthold, J. ; Freude, W. ; Koos, C.
Author_Institution :
Inst. of Photonics & Quantum Electron. (IPQ), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
Abstract :
Photonic wire bonds (PWB) enable single-mode chip-to-chip interconnects that are suitable for mass production. We demonstrate for the first time a single-mode PWB link between two different nanophotonic silicon-on-insulator chips.
Keywords :
integrated optoelectronics; lead bonding; nanophotonics; optical interconnections; optical waveguides; silicon-on-insulator; mass production; nanophotonic silicon-on-insulator chip; photonic wire bonding; single mode chip-to-chip interconnects; Couplers; Optical fibers; Photonics; Silicon; Silicon on insulator technology; Wires;
Conference_Titel :
Group IV Photonics (GFP), 2011 8th IEEE International Conference on
Conference_Location :
London
Print_ISBN :
978-1-4244-8338-9
DOI :
10.1109/GROUP4.2011.6053823
