DocumentCode
1959365
Title
Transcutaneous power link design for implanted systems
Author
Zou, Kui ; Li, Xiuhan ; Zhang, Haixia
Author_Institution
Nat. Key Lab. of Nano/Micro Fabrication Technol., Peking Univ., Beijing
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
763
Lastpage
766
Abstract
Inductive coupling is frequently used for power transfer to implanted electronic devices. Transcutaneous power link design for implanted systems is presented in this paper. MEMS coils which are fabricated with micromanufacturing technology are also tested as receiver coils. The class-E transmitter circuit uses a 5V supply and resonates at a frequency of 1.068 MHz. The peak of transmitter coil current is 400 mA. Using regular receiver coil with diameter of 3 cm and employs high-Q wire can receive 40 mW power. Results of using MEMS coil, the maximum receive power is -41 dBm.
Keywords
micromechanical devices; power transmission; radio links; radio transmitters; MEMS coils; class-E transmitter circuit; current 400 mA; distance 3 cm; frequency 1.068 MHz; high-Q wire; implanted systems; inductive coupling; micromanufacturing technology; power 40 mW; transcutaneous power link design; voltage 5 V; Coils; Coupling circuits; Design engineering; Micromechanical devices; Power engineering and energy; Power supplies; Resonant frequency; Switched capacitor networks; Switches; Transmitters; Class-E; MEMS; high-Q; inductive coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068690
Filename
5068690
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