Development of vacuum packaged CMOS thermoelectric energy harvester

Author

Lee, Chengkuo ; Jin Xie

Author_Institution

Inst. of Microelectron. (IME), Agency for Sci., Technol. & Res. (A*STAR), Singapore

fYear

2009

fDate

5-8 Jan. 2009

Firstpage

803

Lastpage

807

Abstract

A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm² for temperature difference of 6degC between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.

Keywords

CMOS integrated circuits; energy harvesting; finite element analysis; micromechanical devices; solders; thermocouples; thermoelectric conversion; thermoelectric devices; wafer bonding; MEMS based thermoelectric power generator; finite element method; solder based wafer bonding technology; thermocouple junction; vacuum packaged CMOS energy harvester; CMOS technology; Elementary particle vacuum; Finite element methods; Micromechanical devices; Packaging; Power generation; Semiconductor device modeling; Thermoelectricity; Vacuum technology; Wafer bonding; Energy harvester; MEMS; Power generator; Thermoelectric;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on

Conference_Location

Shenzhen

Print_ISBN

978-1-4244-4629-2

Electronic_ISBN

978-1-4244-4630-8

Type

conf

DOI

10.1109/NEMS.2009.5068699

Filename

5068699