Title :
Development of vacuum packaged CMOS thermoelectric energy harvester
Author :
Lee, Chengkuo ; Jin Xie
Author_Institution :
Inst. of Microelectron. (IME), Agency for Sci., Technol. & Res. (A*STAR), Singapore
Abstract :
A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm2 for temperature difference of 6degC between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.
Keywords :
CMOS integrated circuits; energy harvesting; finite element analysis; micromechanical devices; solders; thermocouples; thermoelectric conversion; thermoelectric devices; wafer bonding; MEMS based thermoelectric power generator; finite element method; solder based wafer bonding technology; thermocouple junction; vacuum packaged CMOS energy harvester; CMOS technology; Elementary particle vacuum; Finite element methods; Micromechanical devices; Packaging; Power generation; Semiconductor device modeling; Thermoelectricity; Vacuum technology; Wafer bonding; Energy harvester; MEMS; Power generator; Thermoelectric;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
DOI :
10.1109/NEMS.2009.5068699
