DocumentCode
1960401
Title
The improvement of electrochemical etching process for silicon microchannel plates
Author
Yuan, Ding ; Ci, Pengliang ; Tian, Fei ; Shi, Jing ; Xu, Shaohui ; Xin, Peisheng ; Wang, Lianwei
Author_Institution
Dept. of Electron. Eng., East China Normal Univ., Shanghai
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
964
Lastpage
969
Abstract
Silicon microchannel plates have been explored intensively for numerous applications especially for ultraviolet image detection. The electrochemical etching in hydrofluoric acid-based solutions is known as a technique for porous silicon formation. The function of backside illumination and temperature in the electrochemical etching of large-size and high aspect ratio silicon microchannels plates has been reported in this paper. The backside illumination was provided by a set of triple 150 W tungsten-halogen lamps with a feedback-loop which keeps the constant current density. And a circulation system was set up to maintain the etching temperature. It was found that proper backside illumination and lower temperature can form an improved etching condition in which etching may result in smoother undercut and better surface topography for large-size silicon microchannel plates.
Keywords
etching; image sensors; lighting; microchannel plates; photoelectrochemistry; silicon; surface topography; Si; backside illumination; circulation system; current density; electrochemical etching; feedback-loop; hydrofluoric acid-based solutions; power 150 W; silicon microchannel plates; surface topography; tungsten-halogen lamps; ultraviolet image detection; Contracts; Costs; Current density; Etching; Fabrication; Lamps; Lighting; Microchannel; Silicon; Temperature; Backside Illumination; Photon-Electrochemical Etching; Silicon Microchannel Plates; Temperature; Undercut;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068734
Filename
5068734
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