An accurate method for thermal conductivity measurement of thermally conductive adhesives

Author

Platek, Bartosz ; Falat, Tomasz ; Felba, Jan

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland

fYear

2011

fDate

11-15 May 2011

Firstpage

313

Lastpage

319

Abstract

In the following paper the measurement method of thermal conductivity is described. These method was especially designed for measuring the thermal conductivity of the thermally conductive adhesives. The principal information about the experimental setup, mathematical model of experiment and the change of its uncertainty (calculated using type B method presented in ISO Guide for measurements) depended on measurement parameters are described. The obtained uncertainty from the model was compared with the real measurements of polymer composites filled with silver microflakes.

Keywords

conductive adhesives; electrical conductivity; filled polymers; mathematical analysis; polymers; silver; thermal conductivity measurement; ISO guide; mathematical model; polymer composite; silver microflakes; thermal conductivity measurement; thermally conductive adhesive; Conductivity; Conductivity measurement; Heating; Measurement uncertainty; Temperature measurement; Thermal conductivity; Uncertainty;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2011 34th International Spring Seminar on

Conference_Location

Tratanska Lomnica

ISSN

2161-2528

Print_ISBN

978-1-4577-2111-3

Type

conf

DOI

10.1109/ISSE.2011.6053880

Filename

6053880