DocumentCode :
1960439
Title :
An accurate method for thermal conductivity measurement of thermally conductive adhesives
Author :
Platek, Bartosz ; Falat, Tomasz ; Felba, Jan
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
fYear :
2011
fDate :
11-15 May 2011
Firstpage :
313
Lastpage :
319
Abstract :
In the following paper the measurement method of thermal conductivity is described. These method was especially designed for measuring the thermal conductivity of the thermally conductive adhesives. The principal information about the experimental setup, mathematical model of experiment and the change of its uncertainty (calculated using type B method presented in ISO Guide for measurements) depended on measurement parameters are described. The obtained uncertainty from the model was compared with the real measurements of polymer composites filled with silver microflakes.
Keywords :
conductive adhesives; electrical conductivity; filled polymers; mathematical analysis; polymers; silver; thermal conductivity measurement; ISO guide; mathematical model; polymer composite; silver microflakes; thermal conductivity measurement; thermally conductive adhesive; Conductivity; Conductivity measurement; Heating; Measurement uncertainty; Temperature measurement; Thermal conductivity; Uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
ISSN :
2161-2528
Print_ISBN :
978-1-4577-2111-3
Type :
conf
DOI :
10.1109/ISSE.2011.6053880
Filename :
6053880
Link To Document :
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