DocumentCode
1960630
Title
Practical considerations in RLCK crosstalk analysis for digital integrated circuits
Author
Chan, S.C. ; Shepard, K.L.
Author_Institution
Cadence Design Syst. Inc., San Jose, CA, USA
fYear
2001
fDate
4-8 Nov. 2001
Firstpage
598
Lastpage
604
Abstract
Inductance and inductive crosstalk has become an important new concern for on-chip wires in deep-submicron integrated circuits. Recent advances in extractors to include inductance make possible the extraction of coupled RLCK interconnect networks from large, complex on-chip layouts. We describe the techniques we use in a commercial static noise analysis tool to analyze crosstalk noise due to fully-coupled RLCK networks extracted from layout. Notable are the approaches we use to filter and lump aggressor couplings, as well as the techniques used to handle degeneracies in the modified nodal analysis (MNA)formulation. Furthermore, the nonmonotonicity of interconnect responses in the presence of inductance require additional "sensitizations" in searching the possible switching events inducing the worst-case noise. Comparisons with silicon indicate the need to include the substrate in the extracted models in certain cases.
Keywords
VLSI; circuit layout CAD; crosstalk; digital integrated circuits; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; integrated circuit noise; wiring; RLCK crosstalk analysis; aggressor couplings; complex on-chip layouts; deep-submicron integrated circuits; degeneracies; digital integrated circuits; extracted models; inductive crosstalk; interconnect responses; modified nodal analysis; nonmonotonicity; on-chip wires; static noise analysis tool; switching events; worst-case noise; Circuit noise; Coupling circuits; Crosstalk; Digital integrated circuits; Inductance; Integrated circuit interconnections; Integrated circuit noise; Network-on-a-chip; Timing; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-7247-6
Type
conf
DOI
10.1109/ICCAD.2001.968721
Filename
968721
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