Modeling and simulation of LTCC lamination containing embedded channel

Sag of laminated structures is a common problem in the processing of the low temperature co-fired ceramics (LTCC). The sacrificial layer (starch powder) densification during the lamination process of microfluidic structure fabrication in LTCC is described in the paper. The compressibility of sacrificial volume material (SVM) was measured in the function of pressure. A model was constituted which describes the sag of the covering LTCC layers. Based on these results, the maximum width of channel with tolerable sag can be determined. These results can be used to design with knowing the deformation failure of the LTCC laminate around the inner channel. Simulation of the LTCC lamination is demonstrated to show the ability of the proposed adaptive finite element approach.