Title :
Dual-frequency excitation enhances targeted delivery of ultrasound microbubbles
Author :
Huang, Ting-Yu ; Yeh, Chih-Kuang
Author_Institution :
Dept. of Biomed. Eng. & Environ. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
Ultrasound radiation force (USRF) is commonly used to facilitate the efficiency of targeted bubble adhesion. Studying the property of adherent bubbles provides opportunities for the further control of targeted drug delivery and release. Previous reports show that USRF provides better targeting efficiency as USRF transmitting frequency close to bubbles´ resonance frequency. However, low-frequency ultrasound suffers from a large sample volume such that USRF cannot be pinpointed to a specified region of interest. In this study, we proposed a high-frequency dual-frequency (DF) excitation with a low-frequency envelope component close to bubbles´ resonance frequency to enhance the bubbles targeting efficiency while retaining a high spatial resolution. The results show that dual-frequency excitation with envelope frequency of 20 MHz (DF-20) and 30 MHz (DF-30) nearing the resonance frequency of submicron bubbles provided targeting enhancement up to 4.6-6.2 folds within 2 minutes. In comparisons to DF-3 and DF-10 excitations, which corresponding envelope frequencies were far from the resonance frequency of submicron bubbles, perform only 2.7-3.3 folds enhancement within 5 minutes.
Keywords :
adhesion; biomedical ultrasonics; bubbles; drug delivery systems; excited states; ultrasonic absorption; ultrasonic waves; adherent bubbles; dual-frequency excitation; frequency 20 MHz; frequency 30 MHz; high-frequency dual-frequency excitation; resonance frequency; submicron bubbles; targeted bubble adhesion; targeted drug delivery; ultrasound microbubbles; ultrasound radiation force; Acoustics; Adhesives; Frequency modulation; Mathematical model; Resonant frequency; USA Councils; Ultrasonic imaging; Adhesion; Bubbles; Dual-frequency; Resonance frequency; Ultrasound radiation force;
Conference_Titel :
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4577-0382-9
DOI :
10.1109/ULTSYM.2010.5935878