Title :
Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488)
Abstract :
The following topics are dealt with: microelectronics research and education partnerships; semiconductor processing; CMOS mixed-signal circuits; SOI mixed-signal circuits; microelectronics education; nano/biotechnology; devices and materials; packaging; silicon-on-insulator devices; MEMS and sensors.
Keywords :
CMOS digital integrated circuits; CMOS integrated circuits; electronic engineering education; integrated circuit packaging; micromechanical devices; microsensors; mixed analogue-digital integrated circuits; nanotechnology; semiconductor device models; semiconductor device packaging; semiconductor process modelling; silicon-on-insulator; CMOS mixed-signal circuits; MEMS; SOI mixed-signal circuits; biotechnology; microelectronics education; microelectronics research; nanotechnology; packaging; semiconductor processing; sensors; silicon-on-insulator devices; university/government/industry partnerships; CMOS digital integrated circuits; CMOS integrated circuits; Electronics engineering education; Integrated circuit packaging; Microelectromechanical devices; Microsensors; Mixed analog-digital integrated circuits; Nanotechnology; Semiconductor device modeling; Semiconductor device packaging; Semiconductor process modeling; Silicon on insulator technology;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
Conference_Location :
Boise, ID, USA
Print_ISBN :
0-7803-7972-1
DOI :
10.1109/UGIM.2003.1225684
