• DocumentCode
    1961332
  • Title

    Plenary lecture 2: “Nanoscale field-effect transistors for flexible displays”

  • Author

    Klauk, Hagen

  • Author_Institution
    Max Planck Institute for Solid State Research, Germany
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Abstract
    Nanoscale field-effect transistors are of interest not only for ultra-scale integrated circuits, but also for next-generation active-matrix flat-panel displays. High-resolution flat-panel displays are typically composed of several million individual picture elements (pixels), and in active-matrix displays each pixel contains one or more field-effect transistors that precisely control the pixel brightness during the frame time. For large-area displays on glass substrates, the transistors must be manufactured without the use of high process temperatures, so hydrogenated amorphous silicon or laser-crystallized polycrystalline silicon are often utilized as the semiconductor. If the trend towards increased display resolution, higher frame rates, and greater color fidelity is to continue, field-effect transistors with improved high-frequency performance that can be manufactured on glass substrates will be required. In addition, for the realization of flexible and rollable active-matrix displays, the transistor manufacturing process must be compatible with heat-sensitive polymeric substrates. Finally, the true potential of active-matrix displays will be realized by integrating low-voltage, high-efficiency organic light-emitting diodes with low-voltage, high-frequency nanoscale field-effect transistors on flexible, transparent polymeric substrates.
  • Keywords
    Active matrix technology; Brightness; FETs; Flat panel displays; Glass manufacturing; Manufacturing processes; Organic light emitting diodes; Semiconductor device manufacture; Substrates; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen, China
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068777
  • Filename
    5068777