• DocumentCode
    1962370
  • Title

    Dual-VT 4kb sub-VT memories with <1 pW/bit leakage in 65 nm CMOS

  • Author

    Andersson, Oskar ; Mohammadi, Bahareh ; Meinerzhagen, Pascal ; Burg, Andreas ; Rodrigues, Joachim Neves

  • Author_Institution
    Dept. of Electr. & Inf. Technol., Lund Univ., Lund, Sweden
  • fYear
    2013
  • fDate
    16-20 Sept. 2013
  • Firstpage
    197
  • Lastpage
    200
  • Abstract
    Two standard-cell based subthreshold (sub-VT) memories (SCMs) are presented. The SCMs accomplish the task of robust sub-VT storage and fill the gap of missing sub-VT memory compilers. The storage elements (latches) of these SCMs are custom-designed cells using a dual-VT approach to improve reliability and balance timing. Additionally, two read-logic styles are presented: 1) a segmented 3-state implementation that increases performance compared to a pure 3-state implementation; and 2) a purely MUX-based implementation with the first stage (NAND gate) integrated into the storage cell. Silicon measurements of two 4kb SCMs manufactured in a low-power 65nm CMOS technology show that read access speed increases by 4× and 8× compared to a pure 3-state implementation for the segmented 3-state and integrated NAND, respectively, while bit-access energy only increases by 2.7× and 2× to 39 and 29 fJ, respectively.
  • Keywords
    CMOS memory circuits; flip-flops; logic design; logic gates; low-power electronics; CMOS technology; MUX-based implementation; NAND gate; SCM; latches; memory compilers; read access speed; read-logic styles; segmented implementation; size 65 nm; standard-cell based subthreshold memories; storage capacity 4 Kbit; storage cell; storage elements; sub-VT memories; sub-VT storage; CMOS integrated circuits; Frequency measurement; Latches; Logic gates; Random access memory; Transistors; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ESSCIRC (ESSCIRC), 2013 Proceedings of the
  • Conference_Location
    Bucharest
  • ISSN
    1930-8833
  • Print_ISBN
    978-1-4799-0643-7
  • Type

    conf

  • DOI
    10.1109/ESSCIRC.2013.6649106
  • Filename
    6649106