Title :
New high reliability IC bonding film and its development
Author :
Ganatra, C.P. ; Ohashi, Kazuhiko ; Tabuchi, Yumi ; Yokomizo, Osamu ; Nakamura, Shozo
Author_Institution :
W.L. Gore & Assoc. Inc, Elkton, MD, USA
fDate :
30 June-2 July 2003
Abstract :
The die-attach adhesive used in CSP (Chip Size Package) is a crucial component that determines the reliability of CSP. This paper will describe a die-attach adhesive film with high reliability that has been developed using ePTFE (expanded polytetrafluoroethylene). Two structures have been made: tri-layered and mono-layered adhesive films and their characteristics and differences are studied. Also, thermal residual stress and warp deformation behavior of BOC (Board On Chip) and the μBGA® package are analyzed with a viscoelasticity simulation. It is determined from this simulation that a BOC package using thin mono-layered adhesive film has nearly the same reliability as μBGA®.
Keywords :
adhesive bonding; chip scale packaging; deformation; integrated circuit bonding; integrated circuit reliability; internal stresses; microassembling; polymers; thermal stresses; thin films; viscoelasticity; CSP; PTFE; board on chip; chip size package; die-attach adhesive; monolayered adhesive films; polytetrafluoroethylene; reliability IC bonding film; thermal residual stress; trilayered adhesive films; viscoelasticity; warp deformation; Bonding; Chip scale packaging; Elasticity; Electronic packaging thermal management; Epoxy resins; Resistance heating; Scanning electron microscopy; Temperature; Thermal resistance; Thermal stresses;
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
Print_ISBN :
0-7803-7972-1
DOI :
10.1109/UGIM.2003.1225738
