Abstract :
The following topics are dealt with: interconnect technology; carbon nanotubes; electronics materials; solders; electronics packaging; mechanical properties; and other electronics technology.
Keywords :
carbon nanotubes; electronics packaging; interconnections; mechanical properties; solders; carbon nanotubes; electronics materials; electronics packaging; electronics technology; interconnect technology; mechanical properties; solders;
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
Print_ISBN :
978-1-4577-2111-3
DOI :
10.1109/ISSE.2011.6054069
