DocumentCode
1962623
Title
Solid state RF MEMS resonators in standard CMOS
Author
Bahr, Bichoy ; Marathe, Radhika ; Wentao Wang ; Weinstein, D.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2013
fDate
16-20 Sept. 2013
Firstpage
249
Lastpage
252
Abstract
This paper presents a review of our work in CMOS-MEMS resonators fabricated in Front-End-of-Line (FEOL) processing of standard CMOS technology with no need for post-processing or special packaging. Acoustic resonators composed of Si and SiO2 found in the CMOS stack are demonstrated, confined by Acoustic Bragg Reflectors and sensed using a standard transistor embedded inside the acoustic resonant cavity. The merits of active transistor sensing of MEMS resonators at high frequencies are discussed, leading to the principle of the Resonant Body Transistors (RBTs) described in this work. RBTs realized in IBM´s 32nm SOI process are demonstrated with resonance frequency above 11 GHz and Q~30, spanning a footprint of less than 15 μm2. Finally, thermal stability of <;3 ppm/K is shown for these CMOS-integrated devices. The CMOS-MEMS resonators presented here offer building blocks for RF circuit design which can be integrated seamlessly with supporting circuits for on-chip clocking and signal processing.
Keywords
CMOS integrated circuits; acoustic resonators; micromechanical resonators; thermal stability; CMOS stack; CMOS-MEMS resonators; CMOS-integrated devices; IBM SOI process; RF circuit design; SiO2; acoustic Bragg reflectors; acoustic resonant cavity; acoustic resonators; active transistor sensing; front-end-of-line processing; on-chip clocking; resonance frequency; resonant body transistors; signal processing; size 32 nm; solid state RF MEMS resonators; standard CMOS technology; standard transistor; thermal stability; Acoustics; CMOS integrated circuits; Field effect transistors; Micromechanical devices; Resonant frequency; Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
ESSCIRC (ESSCIRC), 2013 Proceedings of the
Conference_Location
Bucharest
ISSN
1930-8833
Print_ISBN
978-1-4799-0643-7
Type
conf
DOI
10.1109/ESSCIRC.2013.6649119
Filename
6649119
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