DocumentCode :
1962729
Title :
Fabrication of a silicon micro-scalpel with a nanometer cutting edge
Author :
Neudeck, Gerold W. ; Denton, John P. ; Stidham, Mark E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2003
fDate :
30 June-2 July 2003
Firstpage :
304
Lastpage :
307
Abstract :
A silicon micro-scalpel with a nanometer cutting edge bas been fabricated. The fabrication process involves only one mask, and uses RIE, DRIE, and SEG processes. The resulting scalpel is an order of magnitude smaller than any micro-scalpels currently in production. It offers benefits of reduced cost, reduced surface roughness, sharper cutting edges, and blade facets for reduction of tissue or cell tearing. Other structures, such as a micro-probe with a nanometer cutting tip, have also been fabricated using the same process.
Keywords :
cutting tools; elemental semiconductors; epitaxial growth; masks; micromechanical devices; nanotechnology; silicon; sputter etching; surface roughness; blade facets; cell tearing; deep reactive ion etching; microprobes; nanometer cutting edge; reactive ion etching; selective epitaxial growth; sharper cutting edges; silicon microscalpel fabrication; surface roughness; tissue; Blades; Epitaxial growth; Etching; Fabrication; Lithography; Production; Resists; Rough surfaces; Silicon; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
ISSN :
0749-6877
Print_ISBN :
0-7803-7972-1
Type :
conf
DOI :
10.1109/UGIM.2003.1225749
Filename :
1225749
Link To Document :
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