• DocumentCode
    1962750
  • Title

    Piezoelectric polyimide tactile sensors

  • Author

    Atkinson, G.M. ; Pearson, R.E. ; Ounaies, Z. ; Park, C. ; Harrison, J.S. ; Midkiff, J.A.

  • Author_Institution
    Virginia Commonwealth Univ., Richmond, VA, USA
  • fYear
    2003
  • fDate
    30 June-2 July 2003
  • Firstpage
    308
  • Lastpage
    311
  • Abstract
    An important application of piezoelectric materials is for tactile sensing. For non-planar applications, polymer materials offer the potential to provide flexible tactile sensors conforming to a variety of surface geometries. We have demonstrated a fabrication process for fabricating MEMS tactile sensor structures using a novel high-temperature piezoelectric polyimide as the sensing material. The process consists of conventional lithography and metallization processes and uses a sacrificial layer of photoresist. Electrodes are fabricated on the upper and lower surfaces of the suspended bridge and cantilever structures and a self-test electrode is fabricated underlying each suspended component for testing. Prototype structures have been fabricated on silicon substrates for the purposes of process demonstration and characterization.
  • Keywords
    bridges (structures); electrodes; lithography; metallisation; microsensors; photoresists; piezoelectric materials; polymers; tactile sensors; MEMS tactile sensor structure; Si; cantilever structure; conventional lithography; flexible tactile sensors; high-temperature piezoelectric polyimide; metallization; nonplanar applications; photoresist; piezoelectric materials; piezoelectric polyimide tactile sensors; polymer materials; prototype structure; sacrificial layer; self-test electrode; sensing material; silicon substrate; surface geometry; suspended bridge; tactile sensing; Electrodes; Fabrication; Geometry; Lithography; Metallization; Micromechanical devices; Piezoelectric materials; Polyimides; Polymers; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-7972-1
  • Type

    conf

  • DOI
    10.1109/UGIM.2003.1225750
  • Filename
    1225750