• DocumentCode
    1963094
  • Title

    Rectangular polysilicon diaphragms: fabrication and characterization

  • Author

    Woods, Eric V. ; Zhou, Zhiping

  • Author_Institution
    Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2003
  • fDate
    30 June-2 July 2003
  • Firstpage
    366
  • Lastpage
    367
  • Abstract
    Rectangular air-gap diaphragms are difficult to mechanically characterize. A standard fabrication process developed utilizing the smallest efficient etching access ports relative the diaphragm sizes, which ranged from 1406 μm2 to 36864 μm2. Polysilicon diaphragms having a thickness of 1 μm above a 1 μm air gap were fabricated on a silicon substrate and mechanically tested to determine the amount of force relative to geometry and size required to achieve maximum deflection and initial membrane sag using a standard Berkovich tip. The results showed that the force, maximum displacement, and unloading force curve fits followed power law distributions.
  • Keywords
    diaphragms; elemental semiconductors; etching; mechanical testing; photolithography; silicon; etching; mechanical testing; power law distributions; rectangular air-gap diaphragms; rectangular polysilicon diaphragms; silicon substrate; Atomic force microscopy; Biomembranes; Fabrication; Geometry; Hafnium; Silicon; Sociotechnical systems; Testing; Transducers; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial
  • ISSN
    0749-6877
  • Print_ISBN
    0-7803-7972-1
  • Type

    conf

  • DOI
    10.1109/UGIM.2003.1225769
  • Filename
    1225769