Title :
IEEE/CPMT/SEMI. 28th International Electronics Manufacturing Technology Symposium (Cat. No.03CH37479)
Abstract :
The following topics are dealt with: advanced processing technology; "green" manufacturing of electronics; wire bonding process; package design and characterization; wafer level packaging; manufacturing test; reliability and advanced materials; wafer bumping technologies; factory simulation, automation and integration; flip chip technology; surface mount technology (SMT); semiconductor device packaging; chip scale packaging.
Keywords :
chip scale packaging; flip-chip devices; integrated circuit manufacture; lead bonding; semiconductor device manufacture; semiconductor device packaging; surface mount technology; advanced materials; chip scale packaging; electronics manufacturing technology; factory automation; factory simulation; flip chip technology; manufacturing test; package design; reliability; semiconductor device packaging; surface mount technology; wafer bumping technologies; wafer level packaging; wire bonding process;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7933-0
DOI :
10.1109/IEMT.2003.1225868
