In situ ball bond shear measurement using wire bonder bond head

Author

Medding, Jonathan ; Mayer, Michael

Author_Institution

ESEC SA, Cham, Switzerland

fYear

2003

fDate

16-18 July 2003

Firstpage

59

Lastpage

63

Abstract

A novel ball bond quality evaluation method is reported using bond head motion to shear the ball bond with the capillary directly after bonding. The bond head motor controller´s force signal is used to obtain a value that correlates to the ball bond´s shear force as measured on conventional shear test equipment. This new method performs well over a wide range of bonding conditions when using a shear speed of 100 μm/ms and a normal force of 50 mN during shearing. For a 60 μm ball pitch process bonded at ambient temperature, the correlation coefficient is greater than 0.95. Post-bond heating and its effect on this method have also been investigated.

Keywords

bonding processes; controllers; fine-pitch technology; mechanical testing; shearing; 60 micron; ambient temperature; ball bond quality evaluation method; ball bond shear force; bond head motor controller force signal; bonding conditions; correlation coefficient; fine pitch process; in situ ball bond shear measurement; post bond heating; shear speed; shear test equipment; wire bonder bond head; Acceleration; Bonding forces; Force control; Force measurement; Neck; Shearing; Temperature; Test equipment; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International

ISSN

1089-8190

Print_ISBN

0-7803-7933-0

Type

conf

DOI

10.1109/IEMT.2003.1225879

Filename

1225879