Title :
In situ ball bond shear measurement using wire bonder bond head
Author :
Medding, Jonathan ; Mayer, Michael
Author_Institution :
ESEC SA, Cham, Switzerland
Abstract :
A novel ball bond quality evaluation method is reported using bond head motion to shear the ball bond with the capillary directly after bonding. The bond head motor controller´s force signal is used to obtain a value that correlates to the ball bond´s shear force as measured on conventional shear test equipment. This new method performs well over a wide range of bonding conditions when using a shear speed of 100 μm/ms and a normal force of 50 mN during shearing. For a 60 μm ball pitch process bonded at ambient temperature, the correlation coefficient is greater than 0.95. Post-bond heating and its effect on this method have also been investigated.
Keywords :
bonding processes; controllers; fine-pitch technology; mechanical testing; shearing; 60 micron; ambient temperature; ball bond quality evaluation method; ball bond shear force; bond head motor controller force signal; bonding conditions; correlation coefficient; fine pitch process; in situ ball bond shear measurement; post bond heating; shear speed; shear test equipment; wire bonder bond head; Acceleration; Bonding forces; Force control; Force measurement; Neck; Shearing; Temperature; Test equipment; Testing; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
Print_ISBN :
0-7803-7933-0
DOI :
10.1109/IEMT.2003.1225879
