Title :
3D micro optical switching system (3D-MOSS)-Packaging design
Author :
Yoshimura, Tetsuzo ; Tsukada, Gakushi ; Kawakami, Shinji ; Arai, Yukihiko ; Kurokawa, Hiroaki ; Asama, Kunihiko
Author_Institution :
Tokyo Univ. of Technol., Japan
Abstract :
A packaging design providing "3D micro optical switching system (3D-MOSS)" is expected to reduce waveguide crossing points, system size and wiring distance drastically by using variable well optical integrated circuit (VWOIC)
Keywords :
electro-optical switches; integrated circuit packaging; integrated optoelectronics; micro-optics; optical waveguides; switching networks; 3D micro optical switching system; 3D-MOSS; packaging design; system size; variable well optical integrated circuit; waveguide crossing points; wiring distance; Electrooptical waveguides; High speed optical techniques; Optical arrays; Optical design; Optical films; Optical refraction; Optical variables control; Optical waveguides; Packaging; Switching systems;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.968891
