DocumentCode
1963777
Title
3D micro optical switching system (3D-MOSS)-Packaging design
Author
Yoshimura, Tetsuzo ; Tsukada, Gakushi ; Kawakami, Shinji ; Arai, Yukihiko ; Kurokawa, Hiroaki ; Asama, Kunihiko
Author_Institution
Tokyo Univ. of Technol., Japan
Volume
2
fYear
2001
fDate
2001
Firstpage
499
Abstract
A packaging design providing "3D micro optical switching system (3D-MOSS)" is expected to reduce waveguide crossing points, system size and wiring distance drastically by using variable well optical integrated circuit (VWOIC)
Keywords
electro-optical switches; integrated circuit packaging; integrated optoelectronics; micro-optics; optical waveguides; switching networks; 3D micro optical switching system; 3D-MOSS; packaging design; system size; variable well optical integrated circuit; waveguide crossing points; wiring distance; Electrooptical waveguides; High speed optical techniques; Optical arrays; Optical design; Optical films; Optical refraction; Optical variables control; Optical waveguides; Packaging; Switching systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location
San Diego, CA
ISSN
1092-8081
Print_ISBN
0-7803-7105-4
Type
conf
DOI
10.1109/LEOS.2001.968891
Filename
968891
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