DocumentCode :
1963810
Title :
Modeling and simulation of 12.5 Gb/s on a HyperBGA® package
Author :
McBride, Ryan D. ; Rosser, Steven G. ; Nowak, Ronald P.
Author_Institution :
Endicott Interconnect Technol., Inc., NY, USA
fYear :
2003
fDate :
16-18 July 2003
Firstpage :
143
Lastpage :
147
Abstract :
This paper presents high-speed/high-frequency modeling and simulation results for Endicott Interconnect Technologies´ HyperBGA® organic chip-carrier package. Utilizing industry leading advanced software tools, Ansoft LinksTM, Ansoft HFSSTM, and Ansoft Serenade®, this modeling and simulation effort has demonstrated that current HyperBGA® technology will meet the performance requirements for applications running at speeds of 12.5 Gb/s per channel. Throughout the course of this discussion, the general modeling and simulation methodology is revealed, along with the actual physical structures modeled and the inherent assumptions and boundary conditions involved.
Keywords :
ball grid arrays; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; software tools; Endicott Interconnect Technologies; boundary conditions; high frequency modelling; high speed modelling; hyper BGA package; organic chip-carrier package; simulation; simulation effort; software tools; Crosstalk; Distortion; Frequency; Impedance; Insertion loss; Jitter; Packaging; Propagation losses; Routing; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN :
1089-8190
Print_ISBN :
0-7803-7933-0
Type :
conf
DOI :
10.1109/IEMT.2003.1225891
Filename :
1225891
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1963810
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