• DocumentCode
    1963810
  • Title

    Modeling and simulation of 12.5 Gb/s on a HyperBGA® package

  • Author

    McBride, Ryan D. ; Rosser, Steven G. ; Nowak, Ronald P.

  • Author_Institution
    Endicott Interconnect Technol., Inc., NY, USA
  • fYear
    2003
  • fDate
    16-18 July 2003
  • Firstpage
    143
  • Lastpage
    147
  • Abstract
    This paper presents high-speed/high-frequency modeling and simulation results for Endicott Interconnect Technologies´ HyperBGA® organic chip-carrier package. Utilizing industry leading advanced software tools, Ansoft LinksTM, Ansoft HFSSTM, and Ansoft Serenade®, this modeling and simulation effort has demonstrated that current HyperBGA® technology will meet the performance requirements for applications running at speeds of 12.5 Gb/s per channel. Throughout the course of this discussion, the general modeling and simulation methodology is revealed, along with the actual physical structures modeled and the inherent assumptions and boundary conditions involved.
  • Keywords
    ball grid arrays; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; software tools; Endicott Interconnect Technologies; boundary conditions; high frequency modelling; high speed modelling; hyper BGA package; organic chip-carrier package; simulation; simulation effort; software tools; Crosstalk; Distortion; Frequency; Impedance; Insertion loss; Jitter; Packaging; Propagation losses; Routing; Signal design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-7933-0
  • Type

    conf

  • DOI
    10.1109/IEMT.2003.1225891
  • Filename
    1225891
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1963810