Title :
WLCSP back-end considerations
Author :
Tessier, T.G. ; Shin, WS ; Yuen, YK ; Do, BT ; Kuan, F. ; Ling, J.
Author_Institution :
ST Assembly Test Services Inc., Tempe, AZ, USA
Abstract :
The rapid adoption of WLCSPs in a wide range of form factor sensitive packaging applications is underway. To date, the pace of this technology deployment has been slowed by the absence of a robust infrastructure to enable its availability in high volumes. This paper will highlight some of the issues associated with the current WLCSP supply base and efforts that are underway to put in place full turn-key services to support this packaging technology.
Keywords :
chip scale packaging; semiconductor technology; wafer bonding; automatic optical inspection; packaging applications; packaging technology; semiconductor technology; wafer bonding; wafer level chip scale packaging; Assembly; Availability; Current supplies; Dielectrics; Flip chip; Integrated circuit interconnections; Robustness; Routing; Semiconductor device packaging; Testing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
Print_ISBN :
0-7803-7933-0
DOI :
10.1109/IEMT.2003.1225896
