DocumentCode :
1964080
Title :
Open architecture test system: the new frontier
Author :
Pérez, Sergio M. ; Furukawa, Yasuo
Author_Institution :
Advantest America, Santa Clara, CA, USA
fYear :
2003
fDate :
16-18 July 2003
Firstpage :
211
Lastpage :
214
Abstract :
The recent test challenges have resulted ina general consensus that the test industry needs a fundamental change. The increasing complexity of the present day System-on-a-Chip (SOC) devices and simultaneous demand in the test cost reduction has forced both IC manufactures (ATE End Users) and tester vendors (ATE Suppliers) to re-think how IC testing should be done. According to the 2001 ITRS roadmap, without re-engineering, the projected tester cost will continue to increase in the near future; such increasing cost alone requires a fundamental change. A common, open architecture test system platform has been envisioned to address this challenge. The open architecture allows third parties to develop test solutions in the most efficient environment and promotes the reusability of hardware and software modules. Thus, it reduces the development time (time to market) and the overall testing cost. This paper discusses the basic concept of the Semiconductor Test Consortium open architecture (OPEN STARTM) together with the benefits to the industry and the program to implement this industry wide effort.
Keywords :
cost reduction; integrated circuit manufacture; integrated circuit testing; system-on-chip; time to market; IC manufactures; IC testing; ITRS roadmap; hardware modules; open architecture test system; overall testing cost; semiconductor test consortium open architecture; software modules; system-on-chip devices; test cost reduction; time to market; Computer architecture; Costs; Hardware; Integrated circuit testing; Manufacturing industries; Software reusability; Software testing; System testing; System-on-a-chip; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN :
1089-8190
Print_ISBN :
0-7803-7933-0
Type :
conf
DOI :
10.1109/IEMT.2003.1225902
Filename :
1225902
Link To Document :
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