DocumentCode
1964221
Title
The challenges of packaging MEMS components for the all optical networks of the future
Author
Ramsey, David A. ; Basavanhally, Nagesh ; Low, Yee L. ; Scotti, Ronald E. ; Bishop, David J.
Author_Institution
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Volume
2
fYear
2001
fDate
2001
Firstpage
536
Abstract
Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We discuss the new challenges that realizing these benefits presents to the field of photonic packaging
Keywords
micro-optics; mirrors; optical communication equipment; optical switches; packaging; DWDM; MEMS mirrors; MOEMS packaging; all optical networks; angular motion; diffractive elements; free space optics; lightwave network elements; micro-optoelectromechanical systems; optical MEMS devices; optical coupling; optical cross-connects; optical switches; photonic packaging; All-optical networks; High speed optical techniques; Micromechanical devices; Optical attenuators; Optical crosstalk; Optical fiber networks; Optical interferometry; Optical modulation; Packaging; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location
San Diego, CA
ISSN
1092-8081
Print_ISBN
0-7803-7105-4
Type
conf
DOI
10.1109/LEOS.2001.968926
Filename
968926
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