DocumentCode :
1964221
Title :
The challenges of packaging MEMS components for the all optical networks of the future
Author :
Ramsey, David A. ; Basavanhally, Nagesh ; Low, Yee L. ; Scotti, Ronald E. ; Bishop, David J.
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
536
Abstract :
Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We discuss the new challenges that realizing these benefits presents to the field of photonic packaging
Keywords :
micro-optics; mirrors; optical communication equipment; optical switches; packaging; DWDM; MEMS mirrors; MOEMS packaging; all optical networks; angular motion; diffractive elements; free space optics; lightwave network elements; micro-optoelectromechanical systems; optical MEMS devices; optical coupling; optical cross-connects; optical switches; photonic packaging; All-optical networks; High speed optical techniques; Micromechanical devices; Optical attenuators; Optical crosstalk; Optical fiber networks; Optical interferometry; Optical modulation; Packaging; Stimulated emission;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1092-8081
Print_ISBN :
0-7803-7105-4
Type :
conf
DOI :
10.1109/LEOS.2001.968926
Filename :
968926
Link To Document :
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