Title :
Investigation of solder ball attachment processes
Author :
Geiger, David A. ; Shangguan, Dongkai ; Rooney, Dan
Author_Institution :
Flextronics, San Jose, CA, USA
Abstract :
There is a great deal of interest in methods to attach solder balls to substrates for various applications. In this work, different ball attachment methods are evaluated. In particular, two methods are evaluated in detail, including the paste printing and reflow method, and the ball placement method. Different solder alloys are included in the study. Solder ball dimensional accuracy, shear strength, and voiding are also characterized.
Keywords :
printed circuit manufacture; reflow soldering; shear strength; solders; surface mount technology; ball placement method; dimensional accuracy; paste printing; reflow method; shear strength; solder alloys; solder ball attachment; substrates; voiding; Apertures; Assembly systems; Costs; Medical services; Packaging; Printed circuits; Printing; Surface-mount technology; Testing; Vehicles;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
Print_ISBN :
0-7803-7933-0
DOI :
10.1109/IEMT.2003.1225942
