DocumentCode :
1965035
Title :
160-270-GHz InP HEMT MMIC Low-Noise Amplifiers
Author :
Varonen, M. ; Larkoski, P. ; Fung, A. ; Samoska, L. ; Kangaslahti, P. ; Gaier, T. ; Lai, R. ; Sarkozy, S.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
We present two low-noise amplifiers for the frequency range of 160 to 270 GHz. The amplifiers were fabricated using a 35-nm InP HEMT technology and designed for room temperature and cryogenic operation. A four-stage amplifier in a common-source topology and a three-stage amplifier utilizing a cascode stage at the output achieve 15 to 25-dB on-wafer measured gain from 160 to 270 GHz. When packaged in WR5 waveguide housings the amplifiers exhibit room temperature measured noise of 600 to 760 K from 160 to 220 GHz. When cryogenically cooled the three-stage amplifier shows a noise of 80 to 115 K over the range of 164 to 220 GHz. Furthermore, our initial room temperature measurements show a noise figure of 7-8 dB over the 220 to 252 GHz range for a four-stage amplifier packaged in a WR3 waveguide housing.
Keywords :
HEMT integrated circuits; III-V semiconductors; MMIC amplifiers; cryogenic electronics; field effect MIMIC; indium compounds; integrated circuit packaging; low noise amplifiers; millimetre wave amplifiers; waveguides; HEMT MMIC low-noise amplifiers; InP; WR5 waveguide housings; common-source topology; cryogenic operation; four-stage amplifier; frequency 160 GHz to 270 GHz; gain 15 dB to 25 dB; noise figure 7 dB to 8 dB; room temperature measurements; size 35 nm; temperature 293 K to 298 K; temperature 600 K to 760 K; temperature 80 K to 115 K; Cryogenics; Low-noise amplifiers; MMICs; Noise; Noise measurement; Semiconductor device measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE
Conference_Location :
La Jolla, CA
ISSN :
1550-8781
Print_ISBN :
978-1-4673-0928-8
Type :
conf
DOI :
10.1109/CSICS.2012.6340058
Filename :
6340058
Link To Document :
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