• DocumentCode
    1965214
  • Title

    Photonics-Electronics Convergence System for High Density Inter-Chip Interconnects by Using Silicon Photonics

  • Author

    Urino, Yutaka ; Horikawa, Tsuyoshi ; Nakamura, Takahiro ; Arakawa, Yasuhiko

  • Author_Institution
    Inst. for Photonics-Electron. Convergence Syst. Technol. (PECST), Japan
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck for inter-chip interconnects. We propose a photonics-electronics convergence system in response to this issue. To demonstrate the feasibility of the system, we fabricated a high density optical interposer integrated with an arrayed laser diode, an optical splitter, optical modulators, photodetectors, and optical waveguides on a single silicon substrate. Using this system, a 12.5-Gbps error free data transmission and a 6.6-Tbps/cm2 transmission density were achieved. We believe this technology will solve the bottleneck problem among LSI chips in the future.
  • Keywords
    elemental semiconductors; integrated optics; integrated optoelectronics; optical beam splitters; optical interconnections; optical modulation; optical waveguides; photodetectors; semiconductor laser arrays; silicon; Si; arrayed laser diode; bit rate 12.5 Gbit/s; error free data transmission; high density inter-chip interconnects; high density optical interposer; optical modulators; optical splitter; optical waveguides; photodetectors; photonics-electronics convergence system; silicon photonics; single silicon substrate; Adaptive optics; Optical device fabrication; Optical interconnections; Optical modulation; Optical polarization; Optical waveguides; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE
  • Conference_Location
    La Jolla, CA
  • ISSN
    1550-8781
  • Print_ISBN
    978-1-4673-0928-8
  • Type

    conf

  • DOI
    10.1109/CSICS.2012.6340067
  • Filename
    6340067