• DocumentCode
    1965461
  • Title

    Silicon photonics for on-chip interconnections

  • Author

    Mickelson, Alan R.

  • Author_Institution
    Dept. of Electr., Comput. & Energy Eng., Univ. of Colorado, Boulder, CO, USA
  • fYear
    2011
  • fDate
    19-21 Sept. 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The state of the art of silicon photonics for on-chip interconnections is reviewed from both historical and technological perspectives. Discussion of the evolution of optical communications technology highlights salient features of guided wave optical technology. Attributes of silicon photonics indicate how the most desirable features of optical communications can be cost effectively implemented on-chip using already demonstrated silicon photonic components. Results of an experimental investigation of effects of fabrication and runtime variations on photonic device operation are presented. Variation tolerant system design rules are discussed. Attention is placed on motivating why silicon photonics is the replacement for copper interconnection that offers the best possibility for future improvement in performance and reduction in power consumption. The broadcast interconnection effort being carried in the author´s research group is discussed in light of the requirements of many-core interconnections.
  • Keywords
    elemental semiconductors; integrated optoelectronics; optical interconnections; silicon; Si; broadcast interconnection; copper interconnection; guided wave optical technology; on-chip interconnection; optical communication technology; photonic device operation; power consumption; variation tolerant system; Integrated circuit interconnections; Optical device fabrication; Optical interconnections; Optical waveguides; Photonics; Silicon; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2011 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4577-0222-8
  • Type

    conf

  • DOI
    10.1109/CICC.2011.6055360
  • Filename
    6055360