• DocumentCode
    1965571
  • Title

    Measure the Thickness of the Thin-Film Single-Slice-Capacitor

  • Author

    Changhui, Liu ; Chunmei, Xu ; Le, Liu ; Huahui, He

  • Author_Institution
    Sch. of Comput. Sci. & Eng., Wuhan Inst. of Technol., Wuhan
  • fYear
    2008
  • fDate
    23-25 May 2008
  • Firstpage
    770
  • Lastpage
    773
  • Abstract
    According to wave-absorbing material´s electricity characteristic, this text created a kind of new high-performance, low-cost capacitance type absorbing-wave coat´s thickness measuring system. Carry out a research of thin film measurement which from nm-level to micron-level. According to the theory which capacitor working in electric field, it design a special single-piece capacitance sensor. This system can carry on a measurement to the thickness of thin film from nm-level to micron-level. Pass to adopt a kind of new capacitance signal to collect the framework type integration chip(Frame ASIC) CAV424 and shield measure and low price position RISC microcontroller, it carry out a method combine with the difference technique and three-signals-inspect technique. The system can automatically adjust null, correct and remove a great deal of errors. Because the microcontroller have inside place 10 position A/D conversion and driver of LCD, the CAV424 output´s differential voltage signal can directly with the ADC connection, link in the microcontroller, and the structure of system is very simple.
  • Keywords
    analogue-digital conversion; microcontrollers; thickness measurement; thin film capacitors; A/D conversion; CAV424; RISC microcontroller; differential voltage signal; electric field; thin film measurement; thin film single slice capacitor; wave absorbing material electricity characteristic; Application specific integrated circuits; Capacitance measurement; Capacitive sensors; Capacitors; Electric variables measurement; Microcontrollers; Semiconductor device measurement; Sensor phenomena and characterization; Thickness measurement; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Processing (ISIP), 2008 International Symposiums on
  • Conference_Location
    Moscow
  • Print_ISBN
    978-0-7695-3151-9
  • Type

    conf

  • DOI
    10.1109/ISIP.2008.154
  • Filename
    4554191