• DocumentCode
    1965962
  • Title

    760 MHz G6 S/390 microprocessor exploiting multiple Vt and copper interconnects

  • Author

    McPherson, T. ; Averill, R. ; Balazich, D. ; Barkley, K. ; Carey, S. ; Chan, Yan-Cheong ; Chan, Y.H. ; Crea, R. ; Dansky, A. ; Dwyer, R. ; Haen, A. ; Hoffman, D. ; Jatkowski, A. ; Mayo, M. ; Merrill, D. ; McNamara, T. ; Northrop, G. ; Rawlins, J. ; Sigal,

  • Author_Institution
    Div. of Server Dev., IBM Corp., Poughkeepsie, NY, USA
  • fYear
    2000
  • fDate
    9-9 Feb. 2000
  • Firstpage
    96
  • Lastpage
    97
  • Abstract
    The G6 system is a sixth generation CMOS server for the S/390 line of products featuring a 12+2 SMP size and significant frequency improvements obtained through the use of low-Vt devices and copper interconnects. The microprocessor operates at 760 MHz at the fast end of the process distribution. The system ships at 637 MHz in a 12+2 chilled SMP configuration. Measured system performance on the 12 way is 1600 S/390 MIPs, providing over 50% more performance than the G5. This microprocessor uses CMOS7S technology, which has a 0.2 /spl mu/m process. The chip uses 6 levels of copper metal plus an additional layer of local interconnect on a 14.6/spl times/14.7 mm/sup 2/ die with 25M transistors (7M logic/18M array). The power supply is 1.9 V and the chip power is 33 W at 637 MHz.
  • Keywords
    CMOS digital integrated circuits; copper; integrated circuit interconnections; microprocessor chips; very high speed integrated circuits; 0.2 micron; 1.9 V; 33 W; 637 to 760 MHz; CMOS microprocessor; CMOS7S technology; Cu; Cu interconnects; G6 S/390 microprocessor; chilled SMP configuration; low-Vt devices; multiple threshold voltages; CMOS technology; Copper; Frequency; Logic arrays; Marine vehicles; Microprocessors; Power supplies; Power system interconnection; Semiconductor device measurement; System performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5853-8
  • Type

    conf

  • DOI
    10.1109/ISSCC.2000.839707
  • Filename
    839707