• DocumentCode
    1966093
  • Title

    A 1/3-inch 1.3M pixel single-layer electrode CCD with a high-frame-rate skip mode

  • Author

    Hatano, K. ; Fummiya, M. ; Murakami, I. ; Kawasaki, T. ; Ogawa, C. ; Nakashiba, Y.

  • Author_Institution
    ULSI Device Dev. Lab., NEC Corp., Sagamihara, Japan
  • fYear
    2000
  • fDate
    9-9 Feb. 2000
  • Firstpage
    112
  • Lastpage
    113
  • Abstract
    A 1/3-inch 1.3M pixel interline-transfer charge-coupled-device (IT-CCD) image sensor is described for digital camera applications. A 0.25 /spl mu/m-gap single-layer poly-Si is used for the CCD electrodes. The vertical CCD (V-CCD) of the image sensor has ten-phase metal wiring to enable various charge-transfer modes. We have now developed and tested a high-frame-rate skip mode (75 frame/s) and an advanced 3:1 interlaced-scan mode. We developed a method of separately implanting boron ions for the V-CCD and horizontal CCD (H-CCD) in single-layer electrode CCDs with small pixels, to maintain a high charge-transfer efficiency. Furthermore, reducing the pixel size degrades the light-gathering capability of the on-chip microlenses, reducing the sensitivity for a given camera-iris aperture (f number). A new thin-flattened-layer microlens improved the sensitivity of the device. At an f number of 1.4, for example, there was an 18% increase in sensitivity.
  • Keywords
    CCD image sensors; microelectrodes; microlenses; 0.25 micron; 0.33 in; 1.3 Mpixel; camera-iris aperture; charge-transfer efficiency; charge-transfer modes; high-frame-rate skip mode; horizontal CCD; interlaced-scan mode; interline-transfer charge-coupled-device; light-gathering capability; on-chip microlenses; single-layer electrode CCD; ten-phase metal wiring; thin-flattened-layer microlens; vertical CCD; Boron; Charge coupled devices; Digital cameras; Electrodes; Image sensors; Lenses; Microoptics; Pixel; Testing; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5853-8
  • Type

    conf

  • DOI
    10.1109/ISSCC.2000.839714
  • Filename
    839714