Title :
Intermittency detection and mitigation in Ball Grid Array (BGA) packages
Author :
Hofmeister, J.P. ; Walter, P.L.T. ; Goodman, D. ; Ortiz, Enrique G. ; Adams, M.G.P. ; Tracy, T.A.
Author_Institution :
Ridgetop Group, Inc., Tucson
Abstract :
An update on a method (SJ BISTtrade) to detect intermittencies in Ball Grid Array (BGA) packages is presented, and another method (SJ Monitortrade) is introduced. SJ BISTtrade is primarily firmware embedded in the FPGA application; SJ Monitortrade is hardware on an IC chip. Failure of monitored I/O pins on operational, fully-programmed FPGAs is reported by SJ BIST and SJ Monitor to provide positive indication of damage to one or more I/O solder-joint networks of an FPGA on an electronic digital board. The board can then be replaced before accumulated fatigue damage results in intermittent or long-lasting operational faults.
Keywords :
ball grid arrays; built-in self test; ball grid array packages; intermittency detection; Built-in self-test; Condition monitoring; Design engineering; Electric shock; Electronics packaging; Field programmable gate arrays; Strontium; Temperature; Testing; Thermal stresses;
Conference_Titel :
Autotestcon, 2007 IEEE
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-1239-6
Electronic_ISBN :
1088-7725
DOI :
10.1109/AUTEST.2007.4374200
