DocumentCode :
1966179
Title :
Band-gap circuit design challenges in high-performance 32-nm technology
Author :
Buller, J.F. ; Fletcher, J. ; Meyers, S. ; Robinson, M. ; Tamayo, F. ; Prakash, A. ; Cabler, D.
fYear :
2011
fDate :
19-21 Sept. 2011
Firstpage :
1
Lastpage :
4
Abstract :
32-nm complementary metal oxide semiconductor (CMOS) silicon-on-insulator (SOI) with metal gate high-k (MGHK) offers high performance and low power for microprocessors. However, these advanced technologies come with challenges for analog design. Many of the stressor performance elements can adversely impact analog circuit behavior. For example, band-gap circuits, used ubiquitously in voltage references, are one such challenging component. We investigated both design and process methods that resulted in robust band-gap voltage and temperature response characteristics without impacting performance elements for microprocessor frequency.
Keywords :
CMOS digital integrated circuits; microprocessor chips; network synthesis; silicon-on-insulator; CMOS; SOI; analog circuit behavior; band-gap circuit design; band-gap voltage; complementary metal oxide semiconductor; microprocessors; silicon-on-insulator; size 32 nm; stressor performance elements; CMOS integrated circuits; DSL; Equations; P-n junctions; Performance evaluation; Photonic band gap; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location :
San Jose, CA
ISSN :
0886-5930
Print_ISBN :
978-1-4577-0222-8
Type :
conf
DOI :
10.1109/CICC.2011.6055396
Filename :
6055396
Link To Document :
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