An RF transceiver for digital wireless communication in a 25 GHz Si bipolar technology

Author

Puma, G.L. ; Hadjizada, K. ; Van Waasen, S. ; Grewing, C. ; Schrader, P. ; Geppert, W. ; Hanke, A. ; Seth, M. ; Heinen, S.

Author_Institution

Design Center, Infineon Technol., Dusseldorf, Germany

fYear

2000

fDate

9-9 Feb. 2000

Firstpage

144

Lastpage

145

Abstract

The transceiver chip targets the digital enhanced cordless telecommunication (DECT) standard. Integration level and cost are driven by competition in the wireless market. The transceiver IC is realized on the 25 GHz bipolar process. It is primarily suitable for FSK digital mobile radio portable and base stations. The transceiver IC integrates the complete synthesizer including PLL and fully-integrated VCOs for transmit and receive. The receiver is a single-conversion heterodyne architecture with an image-reject frontend. For demodulation of the FSK modulated signal a coincidence demodulator requiring no external adjustment is used. The IC is packaged in a low-cost TSSOP 38 package. The complete transceiver operates from 3.1 V to 5.1 V and needs no external tuning or trimming.

Keywords

UHF integrated circuits; bipolar MMIC; cordless telephone systems; demodulators; digital radio; elemental semiconductors; heterodyne detection; integrated circuit packaging; phase locked loops; silicon; transceivers; 2 GHz; 25 GHz; 3.1 to 5.1 V; DECT standard; PLL; RF transceiver; Si; bipolar technology; coincidence demodulator; demodulation; digital enhanced cordless telecommunication; digital wireless communication; fully-integrated VCOs; image-reject frontend; low-cost TSSOP 38 package; single-conversion heterodyne architecture; Bipolar integrated circuits; Communication standards; Costs; Demodulation; Frequency shift keying; Integrated circuit packaging; Radio frequency; Telecommunication standards; Transceivers; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International

Conference_Location

San Francisco, CA, USA

ISSN

0193-6530

Print_ISBN

0-7803-5853-8

Type

conf

DOI

10.1109/ISSCC.2000.839724

Filename

839724