Title :
An RF transceiver for digital wireless communication in a 25 GHz Si bipolar technology
Author :
Puma, G.L. ; Hadjizada, K. ; Van Waasen, S. ; Grewing, C. ; Schrader, P. ; Geppert, W. ; Hanke, A. ; Seth, M. ; Heinen, S.
Author_Institution :
Design Center, Infineon Technol., Dusseldorf, Germany
Abstract :
The transceiver chip targets the digital enhanced cordless telecommunication (DECT) standard. Integration level and cost are driven by competition in the wireless market. The transceiver IC is realized on the 25 GHz bipolar process. It is primarily suitable for FSK digital mobile radio portable and base stations. The transceiver IC integrates the complete synthesizer including PLL and fully-integrated VCOs for transmit and receive. The receiver is a single-conversion heterodyne architecture with an image-reject frontend. For demodulation of the FSK modulated signal a coincidence demodulator requiring no external adjustment is used. The IC is packaged in a low-cost TSSOP 38 package. The complete transceiver operates from 3.1 V to 5.1 V and needs no external tuning or trimming.
Keywords :
UHF integrated circuits; bipolar MMIC; cordless telephone systems; demodulators; digital radio; elemental semiconductors; heterodyne detection; integrated circuit packaging; phase locked loops; silicon; transceivers; 2 GHz; 25 GHz; 3.1 to 5.1 V; DECT standard; PLL; RF transceiver; Si; bipolar technology; coincidence demodulator; demodulation; digital enhanced cordless telecommunication; digital wireless communication; fully-integrated VCOs; image-reject frontend; low-cost TSSOP 38 package; single-conversion heterodyne architecture; Bipolar integrated circuits; Communication standards; Costs; Demodulation; Frequency shift keying; Integrated circuit packaging; Radio frequency; Telecommunication standards; Transceivers; Wireless communication;
Conference_Titel :
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-5853-8
DOI :
10.1109/ISSCC.2000.839724
