DocumentCode
1967021
Title
New method for verification of analytical device models using transistor parameter fluctuations [MOSFETs]
Author
Kuhn, C. ; Marksteiner, S. ; Kopley, T.E. ; Weber, W.
Author_Institution
Inst. of Electron., Univ. der Bundeswehr, Neubiberg, Germany
fYear
1997
fDate
10-10 Dec. 1997
Firstpage
145
Lastpage
148
Abstract
In this work device parameter fluctuations are considered for verification of analytical device models. We focus on the (WL)/sup -1/2/-dependence of the standard deviation of the threshold voltage /spl sigma//sub Vt/ [1-6]. Besides the known contribution from doping variations, an explicit channel length dependence enhances substantially the (WL)/sup -1/2/-curve. Oxide thickness variation is shown to have minor influence on the V/sub T/-fluctuation and the contribution of mobility fluctuation is completely negligible for a 0.5 /spl mu/m process. It has been found that a percolation model for the current paths through the device can give full account of the experimentally measured values of /spl sigma//sub Vt/.
Keywords
CMOS digital integrated circuits; MOSFET; SPICE; capacitance; circuit analysis computing; electric resistance; integrated circuit interconnections; integrated circuit modelling; ion implantation; masks; percolation; semiconductor device models; semiconductor doping5802184; 0.5 micron; MOSFETs; analytical device models; current paths; doping variations; explicit channel length dependence; oxide thickness variation; percolation model; threshold voltage; transistor parameter fluctuations; Analytical models; Current measurement; Doping profiles; Fluctuations; Implants; MOSFET circuits; Medical simulation; Semiconductor process modeling; Threshold voltage; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-4100-7
Type
conf
DOI
10.1109/IEDM.1997.650280
Filename
650280
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