Ultra-thin silicon-on-sapphire for flip-chip based CMOS/optoelectronic device integration

Author

Kuznia, C.B. ; Albares, D.J. ; Pendleton, M. ; Wong, M. ; Englekirk, M. ; Le, T. ; Thai, S. ; Divakar, M.P. ; Weiss, R. ; Cable, J. ; Reedy, R.E.

Author_Institution

Peregrine Semicond. Corp., San Diego, CA, USA

Volume

2

fYear

2001

fDate

2001

Firstpage

810

Abstract

We describe flip chip bonding of arrayed VCSELs and PIN detectors onto ultra-thin silicon-on-sapphire (UTSi). We present results of UTSi optical transmitters and receivers for 3.125 Gbps multimode parallel optical fiber links at 850 nm

Keywords

CMOS integrated circuits; flip-chip devices; integrated optoelectronics; optical receivers; optical transmitters; p-i-n photodiodes; photodetectors; sapphire; semiconductor laser arrays; silicon; silicon-on-insulator; surface emitting lasers; 850 nm; PIN detectors; Si-Al₂O₃; arrayed VCSELs; flip chip bonding; multimode parallel optical fiber links; optical receivers; optical transmitters; p-i-n photodiodes; silicon-on-sapphire; ultra-thin silicon-on-sapphire flip-chip based CMOS/optoelectronic device integration; CMOS technology; Circuits; Costs; Ethernet networks; Optical fibers; Optical receivers; Optical transmitters; Optoelectronic devices; Substrates; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE

Conference_Location

San Diego, CA

ISSN

1092-8081

Print_ISBN

0-7803-7105-4

Type

conf

DOI

10.1109/LEOS.2001.969062

Filename

969062