• DocumentCode
    1968053
  • Title

    On-chip multi-GHz clocking with transmission lines

  • Author

    Mizuno, M. ; Anjo, K. ; Surni, Y. ; Wakabayashi, H. ; Mogami, T. ; Horiuchi, T. ; Yamashina, M.

  • Author_Institution
    NEC Corp., Sagamihara, Japan
  • fYear
    2000
  • fDate
    9-9 Feb. 2000
  • Firstpage
    366
  • Lastpage
    367
  • Abstract
    In the production of high-speed LSIs, clocking becomes a performance limiter when the clock frequency increases to one gigahertz and beyond. The major obstacles to the reduction of clock-skew are: (1) clock-skew sensitivity to variations in device parameters, supply voltages, and temperatures, (2) inductive effects, which are complicated by the resistance reduction needed for faster signal transmission in such networks as grid or fish-bone clocking networks and (3) power consumption. Taking advantage of the effect of inductance and using a 100 mm/sup 2/ 5 GHz clocking network overcomes these obstacles. The network is notable for (1) 20 ps pp clock skew due to a clock tree/grid structure that takes light speed into consideration, (2) controllability of characteristic impedance due to a multilayered and patterned ground plane microstrip structure, (3) high immunity to process and power supply variations due to use of impedance-controlled transmission line effects, and (4) 66% power reduction due to reflected wave recycling.
  • Keywords
    clocks; high-speed integrated circuits; inductance; integrated circuit interconnections; large scale integration; transmission lines; 5 GHz; characteristic impedance; clock frequency; clock skew; clock tree/grid structure; device parameters; fish-bone clocking networks; high-speed LSIs; impedance-controlled transmission line effects; inductive effects; microstrip structure; on-chip multigigahertz clocking; patterned ground plane; power consumption; power supply variations; reflected wave recycling; resistance reduction; signal transmission; supply voltages; transmission lines; Clocks; Energy consumption; Frequency; Impedance; Inductance; Power transmission lines; Production; Temperature sensors; Transmission lines; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5853-8
  • Type

    conf

  • DOI
    10.1109/ISSCC.2000.839818
  • Filename
    839818