DocumentCode :
1968233
Title :
The Influence of Pressure on SF6 Arc with Contact Evaporation
Author :
Liau, Vui Kien ; Lee, Byeong Yoon ; Song, Ki Dong ; Park, Kyung Yup
Author_Institution :
Adv. Power Apparatus Group, Korean Electrotechnology Res. Inst., Kyungnam
fYear :
0
fDate :
0-0 0
Firstpage :
496
Lastpage :
496
Abstract :
Computer simulation has been performed to investigate the effects of pressure on contact evaporation process of SF6 arc in Laval Nozzle. Computations have been performed by a commercial computational fluids dynamics package (PHOENICS)
Keywords :
SF6 insulation; arcs (electric); computational fluid dynamics; evaporation; nozzles; Laval Nozzle; SF6 arc; commercial computational fluids dynamics package; computer simulation; contact evaporation process; Circuit breakers; Computational fluid dynamics; Computer simulation; Copper; Electrodes; Navier-Stokes equations; Packaging; Plasma temperature; Sulfur hexafluoride; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Field Computation, 2006 12th Biennial IEEE Conference on
Conference_Location :
Miami, FL
Print_ISBN :
1-4244-0320-0
Type :
conf
DOI :
10.1109/CEFC-06.2006.1633286
Filename :
1633286
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1968233
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