Title :
The electrical challenges of packaging the IBM AS/400
Author :
Bartley, Gerald K. ; Dahlen, Paul E.
Author_Institution :
Electr. Packaging Eng., IBM Corp., Rochester, MN, USA
Abstract :
The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.
Keywords :
IBM computers; computer architecture; packaging; IBM AS/400; bus width; computer system design; electrical characteristics; material cost; packaging; physical architecture; technology; Bandwidth; Clocks; Computer architecture; Dielectric losses; Frequency; Packaging; Power systems; Switches; System buses; Testing;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634023
