Title :
The importance of inductance and inductive coupling for on-chip wiring
Author :
Deutsch, A. ; Smith, H. ; Katopis, G.A. ; Becker, W.D. ; Coteus, P.W. ; Surovic, C.W. ; Kopcsay, G.V. ; Rubin, B.J. ; Dunne, R.P. ; Gallo, T. ; Knebel, D.R. ; Krauter, B.L. ; Terman, L.M. ; Sai-Halasz, G.A. ; Reslte, P.J.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top three layers in a five-layer wiring structure and guidelines are formulated. In-plane and between-plane crosstalk and delay dependence on driver and receiver circuit device sizes and line lengths and width are analyzed with representative CMOS circuits. Simplified constant-parameter, distributed coupled-line RLC-circuit representation that approximates the waveforms predicted with frequency-dependent line parameters is shown to be feasible.
Keywords :
CMOS integrated circuits; crosstalk; delays; distributed parameter networks; inductance; wiring; CMOS circuits; between-plane parameters; constant-parameter circuit; crosstalk prediction; delay prediction; device sizes; distributed coupled-line RLC-circuit; driver circuit; five-layer wiring structure; frequency-dependent line parameters; in-plane parameters; inductance; inductive coupling; line lengths; on-chip wiring; receiver circuit; Coupling circuits; Crosstalk; Delay; Driver circuits; Frequency; Impedance; Inductance; Integrated circuit interconnections; Noise generators; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
DOI :
10.1109/EPEP.1997.634037