Title :
"Plane Mesas": A New Technology for High Power Stacked Varactors
Author_Institution :
THOMSON-C.S.F, Département Microélectronique Hyperfréquences, Domaine de Corbeville, B.P. 10, 91401 ORSAY, France
Abstract :
"Plane mesa" is the name for a new technology which yelds definite advantages when compared to traditional mesa structure, for straight forward stacking of chips, or for upside down mounting in order to reduce thermal resistances and (or) the series inductance. An example of practical application is presented in the field of stacked varactors for a doubler between 4 and 8 GHz. A single device in the standard F 27 d package delivery at 8 GHz - 15 Watts of peak power with a 50 % efficiency.
Keywords :
Dielectric materials; Diodes; Etching; Glass; Gold; Metallization; Parasitic capacitance; Passivation; Thermal resistance; Varactors;
Conference_Titel :
Microwave Conference, 1976. 6th European
Conference_Location :
Rome, Italy
DOI :
10.1109/EUMA.1976.332358
