• DocumentCode
    1969236
  • Title

    "Plane Mesas": A New Technology for High Power Stacked Varactors

  • Author

    Chapard, A.

  • Author_Institution
    THOMSON-C.S.F, Département Microélectronique Hyperfréquences, Domaine de Corbeville, B.P. 10, 91401 ORSAY, France
  • fYear
    1976
  • fDate
    14-17 Sept. 1976
  • Firstpage
    669
  • Lastpage
    673
  • Abstract
    "Plane mesa" is the name for a new technology which yelds definite advantages when compared to traditional mesa structure, for straight forward stacking of chips, or for upside down mounting in order to reduce thermal resistances and (or) the series inductance. An example of practical application is presented in the field of stacked varactors for a doubler between 4 and 8 GHz. A single device in the standard F 27 d package delivery at 8 GHz - 15 Watts of peak power with a 50 % efficiency.
  • Keywords
    Dielectric materials; Diodes; Etching; Glass; Gold; Metallization; Parasitic capacitance; Passivation; Thermal resistance; Varactors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1976. 6th European
  • Conference_Location
    Rome, Italy
  • Type

    conf

  • DOI
    10.1109/EUMA.1976.332358
  • Filename
    4131024
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1969236