DocumentCode
1969769
Title
Control of off-state current in scaled PD/SOI CMOS digital circuits
Author
Pelella, M.M. ; Fossum, J.G. ; Krishnan, S.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1998
fDate
5-8 Oct. 1998
Firstpage
147
Lastpage
148
Abstract
A recent study of the scalability of partially depleted (PD) SOI CMOS technology (Chau et al. IEEE IEDM Tech. Dig., p. 591, Dec. 1997) led to the conclusion that it was no better than bulk-Si CMOS for sub-0.25 /spl mu/m digital applications, irrespective of its inherent advantages, because of the higher threshold voltage (V/sub T/) needed to limit the off-state current (I/sub off/) of the nMOSFET, which tends to be high because of the drain (V/sub DS/)-induced floating-body (FB) effect (i.e. the kink effect) in addition to the barrier lowering (DIBL). In this paper, we give a physically insightful analysis of the FB effect on I/sub off/ based on the scaled PD/SOI CMOS technology described by Chau et al. which contradicts the negative assessment of the scalability of SOI digital ICs. Device and circuit simulations of operation at high chip temperatures (55-85/spl deg/C) that are typical for high-performance circuits show that the FB effect can be naturally ameliorated, and that previously proven techniques for controlling FB effects are also effective in limiting I/sub off/. Furthermore, we show that the temperature coefficient of the body-source voltage (V/sub BS/) is strongly dependent on the recombination current (I/sub R/) of the junctions, and the impact on circuit performance of an increased I/sub R/ is shown to be negligible.
Keywords
CMOS digital integrated circuits; MOSFET; circuit simulation; electric current; electron-hole recombination; integrated circuit design; integrated circuit modelling; silicon-on-insulator; thermal analysis; 0.25 micron; 55 to 85 C; FB effect; SOI digital ICs; Si-SiO/sub 2/; body-source voltage temperature coefficient; bulk-Si CMOS; chip temperatures; circuit performance; circuit simulations; device simulations; digital applications; drain-induced barrier lowering; drain-induced floating-body effect; junction recombination current; kink effect; nMOSFET; off-state current; off-state current control; partially depleted SOI CMOS technology; scalability; scaled PD/SOI CMOS digital circuits; scaled PD/SOI CMOS technology; threshold voltage; CMOS digital integrated circuits; CMOS technology; Circuit optimization; Circuit simulation; Digital circuits; MOSFET circuits; Scalability; Temperature control; Temperature dependence; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1998. Proceedings., 1998 IEEE International
Conference_Location
Stuart, FL, USA
ISSN
1078-621X
Print_ISBN
0-7803-4500-2
Type
conf
DOI
10.1109/SOI.1998.723154
Filename
723154
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