Title :
Experiences with Cu Interconnect Metallization at AMD´s Microprocessor Megafab in Dresden
Author :
Deppe, Hans-Raimund
Author_Institution :
AMD Saxony Manufacturing, Germany
fDate :
11-13 September 2001
Keywords :
CMOS technology; Copper; Etching; Lithography; Manufacturing processes; Metallization; Microprocessors; Production; Robust stability; Technology management;
Conference_Titel :
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN :
2-914601-01-8
DOI :
10.1109/ESSDERC.2001.195197
