DocumentCode
1969788
Title
Experiences with Cu Interconnect Metallization at AMD´s Microprocessor Megafab in Dresden
Author
Deppe, Hans-Raimund
Author_Institution
AMD Saxony Manufacturing, Germany
fYear
2001
fDate
11-13 September 2001
Firstpage
3
Lastpage
8
Keywords
CMOS technology; Copper; Etching; Lithography; Manufacturing processes; Metallization; Microprocessors; Production; Robust stability; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 2001. Proceeding of the 31st European
Print_ISBN
2-914601-01-8
Type
conf
DOI
10.1109/ESSDERC.2001.195197
Filename
1506579
Link To Document