High frequency characterization of interconnection on glass fiber inforced PCB (G30)

Author

Owzar, A. ; Weickhmann, C.M. ; Fazelpour, F. ; Windirsch, P. ; Reimers, J. ; Reichl, H.

Author_Institution

Deutsche Telekom AG, Darmstadt, Germany

fYear

1997

fDate

27-29 Oct. 1997

Firstpage

74

Lastpage

78

Abstract

One of the main limitations for the application of the MCM approach is the factor of costs. This problem can be solved by using low cost PCB substrate material. It must be assured, that PCB materials can meet the demands on the interconnection parameter for MCM wiring systems. It is shown by measurement results, that the line impedance is in the required range for MCM application. However, the increase in wiring integration can be a handicap regarding the coupling factor.

Keywords

S-parameters; electric impedance; fibre reinforced composites; high-frequency transmission line measurement; integrated circuit interconnections; multichip modules; printed circuits; G30; HF characterization; MCM wiring systems; coupling factor; glass fiber inforced PCB; interconnection; line impedance; low cost PCB substrate material; Costs; Frequency; Glass; Impedance; Multichip modules; Scattering parameters; Substrates; Testing; Transmission line measurements; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on

Conference_Location

Austin, TX

Print_ISBN

0-7803-8649-3

Type

conf

DOI

10.1109/EPEP.1997.634042

Filename

634042