• DocumentCode
    1970644
  • Title

    Evanescent-mode analysis of short-channel effects in fully depleted SOI and related MOSFETs

  • Author

    Monroe, D. ; Hergenrother, J.M.

  • Author_Institution
    Bell Labs., Lucent Technol., Murray Hill, NJ, USA
  • fYear
    1998
  • fDate
    5-8 Oct. 1998
  • Firstpage
    157
  • Lastpage
    158
  • Abstract
    Fully depleted SOI (FDSOI) and double-gate (DG) structures offer significant improvement in long-channel subthreshold swing over bulk devices, which are heavily doped to reduce short-channel effects (SCEs) such as threshold voltage (V/sub T/) roll-off and drain-induced barrier lowering (DIBL). Using idealized devices, we argue that previous SCE analyses fail to solve the electrostatics problem, and scale incorrectly with device dimensions. Although FDSOI devices can be as much as three (=/spl epsiv//sub Si///spl epsiv//sub oxide/) times shorter than bulk devices with identical SCE, our analysis indicates that this requires both buried oxide and silicon thicknesses to be 30-60% of the effective gate length L/sub eff/, a daunting prospect for L/sub eff/<100 nm.
  • Keywords
    MOSFET; buried layers; nanotechnology; semiconductor device models; silicon-on-insulator; 100 nm; FDSOI device length; FDSOI structures; SCE analysis; SCE analysis scaling; Si-SiO/sub 2/; bulk devices; buried oxide thickness; device dimensions; double-gate structures; drain-induced barrier lowering; effective gate length; electrostatics; evanescent-mode analysis; fully depleted SOI MOSFETs; fully depleted SOI structures; long-channel subthreshold swing; short-channel effects; silicon thickness; threshold voltage roll-off; Analytical models; Artificial intelligence; Capacitance; Electrons; Failure analysis; Laplace equations; MOSFETs; Manufacturing; Substrates; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1998. Proceedings., 1998 IEEE International
  • Conference_Location
    Stuart, FL, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-4500-2
  • Type

    conf

  • DOI
    10.1109/SOI.1998.723159
  • Filename
    723159